A review of thick film microwave integrated circuit technology
โ Scribed by Clive Newport
- Publisher
- Elsevier Science
- Year
- 1984
- Tongue
- English
- Weight
- 517 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0026-2692
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โฆ Synopsis
Continuing improvements in hybrid technology have resulted in the extension of upper frequency limits into the microwave spectrum. Now, microwave assemblies based on thin or thick film technology are relatively common, offering a wide choice of system fabrication methods which are truly solid state and compatible with modern active devices.
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