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A review of thick film microwave integrated circuit technology

โœ Scribed by Clive Newport


Publisher
Elsevier Science
Year
1984
Tongue
English
Weight
517 KB
Volume
15
Category
Article
ISSN
0026-2692

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โœฆ Synopsis


Continuing improvements in hybrid technology have resulted in the extension of upper frequency limits into the microwave spectrum. Now, microwave assemblies based on thin or thick film technology are relatively common, offering a wide choice of system fabrication methods which are truly solid state and compatible with modern active devices.


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