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A review of mechanical properties of lead-free solders for electronic packaging

✍ Scribed by Hongtao Ma; Jeffrey C. Suhling

Publisher: Springer
Year: 2009
Tongue: English
Weight: 852 KB
Volume: 44
Category: Article
ISSN: 0022-2461
DOI: 10.1007/s10853-008-3125-9

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