A reliability analysis of the electrostatic discharge sensitivity of CMOS devices
β Scribed by D.M. Barry; M. Meniconi; A.V. Gurican
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 340 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
continued from page 75 precious metal-based materials. These differences are primarily related to the ease of oxidation of the solder alloy powders. The relationship between solder flux chemistry and the reactivity of solder powders is described in terms of functional performance. Production and Pr
The optimization of shape and topology of piezo-patches or layered piezo-electrical material attached to structural parts, such as elastic bodies, plates and shells, plays a major role in the design of smart structures, as piezo-mechanic-acoustic devices in loudspeakers or energy harvesters. While t