A reconfigurable dual-frequency slot-loaded microstrip antenna controlled by pin diodes

✍ Scribed by Shynu S. V.; Gijo Augustin; C. K. Aanandan; P. Mohanan; K. Vasudevan

• Publisher: John Wiley and Sons
• Year: 2005
• Tongue: English
• Weight: 163 KB
• Volume: 44
• Category: Article
• ISSN: 0895-2477
• DOI: 10.1002/mop.20639

✦ Synopsis

2.3. Broadband Microstrip-Line-to-Rectangular-Waveguide Transition

One of the design parameters of the millimeter-wave module is to minimize the millimeter-wave interface length in order to reduce signal loss and mechanical complexity. Usually the transitions consist of several separated pieces that require judicious assembly, and a tuning mechanism is also essential. However, the module packaging (including the transition) is designed to have a simple structure composed of the least number of parts and robustness to compensate for assembling error.

The E-plane probe, the most commonly used type of transition, is well suited for simple and compact integration of the planar circuits with rectangular waveguide (RWG) [12]. It consists of a microstrip line on an alumina substrate inserted into the WR-15 RWG, as shown in Figure 5. The measured insertion loss of the back-to-back connected transition is 2.2 dB, as shown in Figure 6. The extracted insertion loss for a single transition is less than 0.4 dB from 50 to 75 GHz.

3. CONCLUSION

Broadband planar integration and packaging of millimeter-wave circuits has been proposed and demonstrated at the V-band. The proposed wideband microstrip-line-to-IWG transition is suitable for compact integration of planar circuits and the waveguide on the same substrate. It has features of low loss, wide bandwidth, and a simple structure, compared to conventional IWG transitions. The fabricated planar bandpass filter using the IWG transition exhibits an insertion loss of 3 dB with a 3.3% bandwidth at a center frequency of 62 GHz. The GCPW ribbon-bond interconnection and waveguide transition using the E-plane probe have low loss and robustness to compensate for assembling error. The proposed integration and packaging allow the design of a fully integrated, small-size planar millimeter-wave front-end with low loss.