A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

✍ Scribed by H. Xu; C. Liu; V.V. Silberschmidt; S.S. Pramana; T.J. White; Z. Chen

• Book ID: 113897880
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 330 KB
• Volume: 61
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2009.03.034