๐”– Bobbio Scriptorium
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A PEEC with a new capacitance model for circuit simulation of interconnects and packaging structures

โœ Scribed by Yi Cao; Zheng-Fan Li; Ji-Feng Mao; Jun-Fa Mao


Book ID
114553669
Publisher
IEEE
Year
2000
Tongue
English
Weight
187 KB
Volume
48
Category
Article
ISSN
0018-9480

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