Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for Circuit Simulations and a Comparison With Cu Interconnects for Sealed Technologies

✍ Scribed by Hong Li; Yin, W.-Y.; Jun-Fa Mao

• Book ID: 117907778
• Publisher: IEEE
• Year: 2006
• Tongue: English
• Weight: 318 KB
• Volume: 25
• Category: Article
• ISSN: 0278-0070
• DOI: 10.1109/tcad.2006.883920