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A novel low temperature integration of hybrid CMOS devices on flexible substrates

✍ Scribed by S. Gowrisanker; M.A. Quevedo-Lopez; H.N. Alshareef; B.E. Gnade; S. Venugopal; R. Krishna; K. Kaftanoglu; D.R. Allee

Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
868 KB
Volume
10
Category
Article
ISSN
1566-1199

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## Abstract **Summary:** The driving forces behind the development of flexible electronics are their flexibility, lightweightedness, and potential for low‐cost manufacturing. However, because of physical limitations, traditional thermal processes cause deformations in the flexible substrate. As a r