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A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

✍ Scribed by Puqi Ning; Lei, T.G.; Fei Wang; Guo-Quan Lu; Ngo, K.D.T.; Rajashekara, K.

Book ID: 115458480
Publisher: IEEE
Year: 2010
Tongue: English
Weight: 709 KB
Volume: 25
Category: Article
ISSN: 0885-8993
DOI: 10.1109/tpel.2010.2046498

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