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[IEEE 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Washington, DC, USA (2009.02.15-2009.02.19)] 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition - A Novel High-Temperature Planar Package for SiC Multi-Chip Phase-Leg Power Module

✍ Scribed by Ning, Puqi; Lei, Thomas G.; Wang, Fred; Lu, Guo-Quan; Ngo, Khai D. T.

Book ID: 115458420
Publisher: IEEE
Year: 2009
Weight: 764 KB
Volume: 0
Category: Article
ISBN: 1424428114
DOI: 10.1109/apec.2009.4802958

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