## Abstract The low temperature‐induced strain in the thin brittle InSb upper part of ready‐to‐work InSb‐based infrar‐ed photo‐detectors (Hybrid Focal Plane Arrays (HFPA) technology) has been measured using X‐ray diffraction (XRD). Assuming no shear component and no surface normal stress in the InS
✦ LIBER ✦
A novel device for measuring thermal strain in materials
✍ Scribed by F.R Cichocki Jr.
- Book ID
- 117356709
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 160 KB
- Volume
- 54
- Category
- Article
- ISSN
- 0167-577X
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