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A note on the thermal modelling of power semiconductor devices using the network analogue

✍ Scribed by Chi Chung Wong

Publisher: John Wiley and Sons
Year: 2002
Tongue: English
Weight: 96 KB
Volume: 15
Category: Article
ISSN: 0894-3370
DOI: 10.1002/jnm.443

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✦ Synopsis

Abstract

The aim of this note is to point out that the boundary condition for the network modelling of thermal problems may have been incorrectly used in some previous studies. It is shown that the accuracy of the network analogue or the equivalent finite‐difference method is on the par with the finite‐element method for very fast transient thermal simulations. Copyright © 2002 John Wiley & Sons, Ltd.

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