Simulation of the transient temperature distribution in a high-power semiconductor device cooling apparatus using heat pipes

✍ Scribed by Suzuki, Osamu ;Fujioka, Kazumasa ;Kuwahara, Heikichi ;Takasaki, Toshio

• Publisher: John Wiley and Sons
• Year: 1997
• Tongue: English
• Weight: 541 KB
• Volume: 26
• Category: Article
• ISSN: 0096-0802
• DOI: 10.1002/(sici)1520-6556(1997)26:2<107::aid-htj4>3.0.co;2-#