A new approach to chip size package using meniscus soldering and FPC-bonding

✍ Scribed by Kallmayer, C.; Jung, E.; Kasulke, P.; Azadeh, R.; Azdasht, G.; Zakel, E.; Reichl, H.

• Book ID: 114560645
• Publisher: IEEE
• Year: 1998
• Weight: 892 KB
• Volume: 21
• Category: Article
• ISSN: 1083-4400
• DOI: 10.1109/3476.670028