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A multilevel epoxy substrate for flip-clip hybrid multichip module applications

✍ Scribed by Tsunashima, E.; Okuno, A.

Book ID: 114560299
Publisher: IEEE
Year: 1992
Tongue: English
Weight: 428 KB
Volume: 15
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.124198

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