Advanced ceramic substrates for multichip modules with multilevel thin film interconnects : Brian C. Foster, Frank J. Bachner, Ellen S. Tormey, Mark A. Occhionero and Paul A. White. IEEE Trans. Compon. Hybrids mfg Technol. 14(4), 784 (1991)

• Book ID: 103282498
• Publisher: Elsevier Science
• Year: 1992
• Tongue: English
• Weight: 115 KB
• Volume: 32
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(92)90768-g