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A mechanical decapsulation technique for epoxide-packaged semiconductor components

✍ Scribed by E. J. Chwastek; I. A. Holland

Book ID: 112184347
Publisher: John Wiley and Sons
Year: 1988
Tongue: English
Weight: 539 KB
Volume: 4
Category: Article
ISSN: 0748-8017
DOI: 10.1002/qre.4680040106

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