✦ LIBER ✦
Evaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation technique
✍ Scribed by F. Christiaens; B. Vandevelde; E. Beyne; J. Roggen
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 321 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
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