High-speed solder bump inspection system
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Hiroyuki Tsukahara; Yoji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Toru Nishi
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Article
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2000
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John Wiley and Sons
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English
โ 538 KB
We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, diameter, and brightness of bumps at very high speed. The bump height is measured