A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers

✍ Scribed by X.H. Zhang; Z.J. Pei; Graham R. Fisher

• Book ID: 108145881
• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 367 KB
• Volume: 46
• Category: Article
• ISSN: 0890-6955
• DOI: 10.1016/j.ijmachtools.2005.05.008