A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips

✍ Scribed by Hopper, A.; Jones, A.; Augur, R.A.; Fice, M.J.; Blythe, S.; Ahmed, H.

• Book ID: 114560298
• Publisher: IEEE
• Year: 1992
• Tongue: English
• Weight: 839 KB
• Volume: 15
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.124197