✦ LIBER ✦
A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips : Andy Hopper et al. IEEE Trans. Compon. Hybrids mfg Technol. 15, 97 (1992)
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 118 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0026-2714
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