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A diffusional model for transient liquid phase bonding

โœ Scribed by S.R. Cain; J.R. Wilcox; R. Venkatraman


Book ID
108492085
Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
767 KB
Volume
45
Category
Article
ISSN
1359-6454

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The vast majority of man-made structures, from skyscrapers to microelectronic devices, require joints between similar or dissimilar materials. Ideally, joining is fast, reliable, and inexpensive. Conventional joining technologies often fail to provide these characteristics for applications involving