๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Overview of transient liquid phase and partial transient liquid phase bonding

โœ Scribed by Grant O. Cook; Carl D. Sorensen


Publisher
Springer
Year
2011
Tongue
English
Weight
655 KB
Volume
46
Category
Article
ISSN
0022-2461

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Ultrarapid Transient-liquid-phase Bondin
โœ Sung M. Hong; Christopher C. Bartlow; Thomas B. Reynolds; Joseph T. McKeown; And ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 307 KB ๐Ÿ‘ 2 views

The vast majority of man-made structures, from skyscrapers to microelectronic devices, require joints between similar or dissimilar materials. Ideally, joining is fast, reliable, and inexpensive. Conventional joining technologies often fail to provide these characteristics for applications involving