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A compact model for early electromigration failures of copper dual-damascene interconnects

✍ Scribed by R.L. de Orio; H. Ceric; S. Selberherr

Book ID: 113800563
Publisher: Elsevier Science
Year: 2011
Tongue: English
Weight: 587 KB
Volume: 51
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.07.049

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📜 SIMILAR VOLUMES

[IEEE 2011 International Conference on S

[IEEE 2011 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Osaka, Japan (2011.09.8-2011.09.10)] 2011 International Conference on Simulation of Semiconductor Processes and Devices - A compact model for early electromigration lifetime estimation

✍ de Orio, R. L.; Ceric, H.; Selberherr, S. 📂 Article 📅 2011 🏛 IEEE ⚖ 270 KB