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A Co-based surface activator for electroless copper deposition

✍ Scribed by L. Naruškevičius; L. Tamašauskaitė-Tamašiūnaitė; A. Žielienė; V. Jasulaitienė

Book ID
113919600
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
738 KB
Volume
206
Category
Article
ISSN
0257-8972

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Evaluation of electroless deposited Co(W,P) thin films as diffusion barriers for copper metallization
✍ A. Kohn; M. Eizenberg; Y. Shacham-Diamand; B. Israel; Y. Sverdlov 📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 231 KB

Electroless deposited Co(W,P) thin films were evaluated as diffusion barriers for copper metallization. Capacitance versus time measurements of MOS structures as well as SIMS depth profiles indicate that 30-nm-thick films can function as effective barriers against copper diffusion after thermal trea