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4927505 Metallization scheme providing adhesion and barrier properties

✍ Scribed by RavinderK Sharma; Harry Geyer; Douglas Mitchell

Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
92 KB
Volume
31
Category
Article
ISSN
0026-2714

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The aim of the paper is to review certain aspects of the electronic structure and properties of metal-a-semiconductor barriers which are of relevance to the theme of this Conference. The discussion will be confined to amorphous silicon (a-%) prepared by the plasma decomposition of silane, which is o