Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes

✍ Scribed by Luke England; Siew Tze Eng; Chris Liew; Hock Heng Lim

• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 802 KB
• Volume: 51
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2010.02.014