𝔖 Bobbio Scriptorium
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4736520 Process for assembling integrated circuit packages

✍ Scribed by James Morris


Publisher
Elsevier Science
Year
1989
Tongue
English
Weight
86 KB
Volume
29
Category
Article
ISSN
0026-2714

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## Abstract Various plastic films of a melting point above 170Β°C were selected for IC package in laser marking. These films include: (1) polyacetal, (2) polycarbonate, (3) polyester, and (4) nylon. They are in a form of a homogeneous layer, polymer blend, or multilayer structure. The plastic films