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3D silicon pixel sensors: Recent test beam results

✍ Scribed by P. Hansson; J. Balbuena; C. Barrera; E. Bolle; M. Borri; M. Boscardin; M. Chmeissan; G.-F. Dalla Betta; G. Darbo; C. Da Via; E. Devetak; B. DeWilde; D. Su; O. Dorholt; S. Fazio; C. Fleta; C. Gemme; M. Giordani; H. Gjersdal; P. Grenier; S. Grinstein; J. Hasi; K. Helle; F. Huegging; P. Jackson; C. Kenney; M. Kocian; I. Korolkov; A. La Rosa; A. Mastroberardino; A. Micelli; C. Nellist; P. Nordahl; F. Rivero; O. Rohne; H. Sandaker; D. Silverstein; K. Sjoebaek; T. Slaviec; J. Stupak; I. Troyano; J. Tsung; D. Tsybychev; N. Wermes; C. Young

Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
878 KB
Volume
628
Category
Article
ISSN
0168-9002

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✍ K.-H. Becks; P. Gerlach; C. Grah; P. MΓ€ttig; T. Rohe πŸ“‚ Article πŸ“… 2006 πŸ› Elsevier Science 🌐 English βš– 792 KB

The Multi-Chip-Module-Deposited (MCM-D) technique has been used to build hybrid pixel detector assemblies. This paper summarises the results of an analysis of data obtained in a test beam campaign at CERN. Single-chip hybrids made of ATLAS pixel prototype read-out electronics and special sensor tile