3D Integration for VLSI Systems

✍ Chuan Seng Tan; Kuan-Neng Chen; Steven J. Koester (eds.) 📂 Library 📅 2012 🏛 Pan Stanford; CRC Press 🌐 English

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usual

Integrated Interconnect Technologies for

📁 Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems)

✍ Muhannad S. Bakir, James D. Meindl 📂 Library 📅 2008 🌐 English

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthro

Integrated Interconnect Technologies for

📁 Integrated Interconnect Technologies for 3D Nanoelectronic Systems

✍ Muhannad S. Bakir, James D. Meindl 📂 Library 📅 2008 🏛 Artech House Publishers 🌐 English

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthro

Integrated Interconnect Technologies for

📁 Integrated Interconnect Technologies for 3D Nanoelectronic Systems

✍ Muhannad S. Bakir, James D. Meindl 📂 Library 📅 2008 🏛 Artech House 🌐 English

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthro

3D Integration in VLSI Circuits: Impleme

📁 3D Integration in VLSI Circuits: Implementation Technologies and Applications

✍ Katsuyuki Sakuma 📂 Library 📅 2018 🏛 CRC Press/Taylor & Francis Group 🌐 English

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to

Electrical Modeling and Design for 3D Sy

📁 Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

✍ Er?Ping Li(auth.), Lajos Hanzo(eds.) 📂 Library 📅 2012 🏛 Wiley-IEEE Press 🌐 English

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systemsBased on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power