3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs

✍ Scribed by T. Azoui; P. Tounsi; Ph. Dupuy; L. Guillot; J.M. Dorkel

• Book ID: 113800499
• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 971 KB
• Volume: 51
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2011.06.018