3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules

✍ Scribed by Sasaki, S.; Konno, R.; Tomimuro, H.; Ohsaki, T.

• Book ID: 114560270
• Publisher: IEEE
• Year: 1991
• Tongue: English
• Weight: 578 KB
• Volume: 14
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.105129