✦ LIBER ✦
3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules : Shinichi Sasaki, et al. IEEE Trans. Compon. Hybrids mfg Technol. 14(4), 755 (1991)
- Book ID
- 103281870
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 112 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0026-2714
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