𝔖 Bobbio Scriptorium

✦ LIBER ✦

2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

✍ Scribed by Artur Wymysłowski

Book ID: 116748878
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 118 KB
Volume: 52
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2012.03.010

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Guest Editorial: 2007 EuroSimE conferenc

Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

✍ Artur Wymysłowski 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 111 KB

[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Modeling of integrated inductors and transformers for RF applications

✍ Lopez-Villegas, J.M.; Sieiro, J. 📂 Article 📅 2005 🏛 IEEE ⚖ 765 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Multi-physics simulation and reliability analysis for RF-MEMS devices

✍ Rottenberg, X.; Czarnecki, P.; Tilmans, H. A. C.; De Raedt, W.; De Wolf, I. 📂 Article 📅 2008 🏛 IEEE ⚖ 583 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Efficient electrothermal simulation of power electronics for hybrid electric vehicle

✍ Dehbi, Anis; Wondrak, Wolfgang; Rudnyi, Evgenii B.; Killat, Udo; van Duijsen, Pe 📂 Article 📅 2008 🏛 IEEE ⚖ 779 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Investigation of thermal performance of various power-device packages

✍ Xuejun Fan, ; Aung, Kyaw T.; Li, X. 📂 Article 📅 2008 🏛 IEEE ⚖ 409 KB

[IEEE Multi-Physics simulation and Exper

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Use the reverse engineering technique to link COMSOL and ANSYS softwares

✍ Achkar, Hikmat; Pennec, Fabienne; Peyrou, David; Sartor, Marc; Plana, Robert; Po 📂 Article 📅 2008 🏛 IEEE ⚖ 522 KB