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Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires

✍ Scribed by Yang, B.; Motz, C.; Rester, M.; Dehm, G.


Book ID
119996733
Publisher
Taylor and Francis Group
Year
2012
Tongue
English
Weight
627 KB
Volume
92
Category
Article
ISSN
1478-6435

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