Yield Prediction for Integrated Circuits Manufacturing Through Hierarchical Bayesian Modeling of Spatial Defects

✍ Scribed by Tao Yuan; Ramadan, S.Z.; Bae, S.J.

• Book ID: 114668950
• Publisher: IEEE
• Year: 2011
• Tongue: English
• Weight: 1021 KB
• Volume: 60
• Category: Article
• ISSN: 0018-9529
• DOI: 10.1109/tr.2011.2161698