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Wetting, adhesion and diffusion in Cu–Al/SiO2 system at 1473 K

✍ Scribed by Ping Shen; Hidetoshi Fujii; Kiyoshi Nogi

No coin nor oath required. For personal study only.

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Wetting, adhesion and diffusion in Cu–Al/SiO2 system at 1473&#xa0;K