Wedge indentation studies of low-k films at inert, water and ambient environments

Determining the interfacial toughness of

Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies

✍ Kong Boon Yeap; Kaiyang Zeng; Dongzhi Chi 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 653 KB

This paper presents further studies to determine the interface toughness of low-k films (black diamond (BD) film) using wedge indentation experiments and analysis. In addition, the effects of film thickness on the delamination mode are studied and an analysis methodology is proposed. The curvature o