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Warpage Estimation of a Multilayer Package Including Cure Shrinkage Effects

✍ Scribed by Jansen, Kaspar M. B.; Öztürk, Berkan


Book ID
120996306
Publisher
Institute of Electrical and Electronics Engineers
Year
2013
Tongue
English
Weight
638 KB
Volume
3
Category
Article
ISSN
2156-3950

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