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Warpage and stress relaxation of the transferred GaN LED epi-layer on electroplated Cu substrates

✍ Scribed by Y. C. Lin, Y. S. Liu, C. L. Chang, C. Y. Liu


Book ID
120723261
Publisher
The Korean Institute of Metals and Materials
Year
2013
Tongue
English
Weight
220 KB
Volume
9
Category
Article
ISSN
1738-8090

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