✦ LIBER ✦
Wafer scale interconnections for GaAs packaging — applications to RISC architecture: McDonald, J F, Greub, H J, Steinvorth, R H, Donlan, B J and Bergendahl, A SIEEE Computer Vol 20 No 4 (April 1987) pp 21–35
- Publisher
- Elsevier Science
- Year
- 1987
- Tongue
- English
- Weight
- 111 KB
- Volume
- 11
- Category
- Article
- ISSN
- 0141-9331
No coin nor oath required. For personal study only.