Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating

✍ Scribed by N. Lorenz; M.D. Smith; D.P. Hand

• Book ID: 113800467
• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 836 KB
• Volume: 51
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2011.04.010