✦ LIBER ✦
Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP
✍ Scribed by Jiajie Tang; Xiaoyun Ding; Fei Geng; Xiaowei Sun; Le Luo
- Publisher
- Springer-Verlag
- Year
- 2011
- Tongue
- English
- Weight
- 839 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0946-7076
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