Wafer-level BCB bonding using a thermal press for microfluidics

✍ Scribed by Xiaodong Zhou; Selven Virasawmy; Chenggen Quan

• Book ID: 106185598
• Publisher: Springer-Verlag
• Year: 2008
• Tongue: English
• Weight: 360 KB
• Volume: 15
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-008-0712-2