Wafer bonding and epitaxial transfer of GaSb-based epitaxy to GaAs for monolithic interconnection of thermophotovoltaic devices

✍ Scribed by C. A. Wang; D. A. Shiau; P. G. Murphy; P. W. O’Brien; R. K. Huang; M. K. Connors; A. C. Anderson; D. Donetsky; S. Anikeev; G. Belenky; D. M. Depoy; G. Nichols

• Book ID: 107453227
• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 181 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0182-y