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Void reduction in autoclave processing of thermoset composites: Part 2: Void reduction in a microwave curing process

✍ Scribed by F.Y.C. Boey; S.W. Lye

Book ID: 115839838
Publisher: Elsevier Science
Year: 1992
Weight: 461 KB
Volume: 23
Category: Article
ISSN: 0010-4361
DOI: 10.1016/0010-4361(92)90187-y

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