✦ LIBER ✦

Void growth in copper during high-temperature power-law creep

✍ Scribed by K. Dzieciol; A. Borbély; F. Sket; A. Isaac; M. Di Michiel; P. Cloetens; Th. Buslaps; A.R. Pyzalla

No coin nor oath required. For personal study only.

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