✦ LIBER ✦
Void free bonding of large silicon dice using gold-tin alloys
✍ Scribed by Matijasevic, G.S.; Wang, C.Y.; Lee, C.C.
- Book ID
- 117872799
- Publisher
- IEEE
- Year
- 1990
- Tongue
- English
- Weight
- 825 KB
- Volume
- 13
- Category
- Article
- ISSN
- 0148-6411
- DOI
- 10.1109/33.62563
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