✦ LIBER ✦
Void-free anisotropic deposition for IC interconnect with polyethylene glycol as the single additive based on uneven adsorption distribution
✍ Scribed by B.-H. Wu; C.-C. Wan; Y.-Y. Wang
- Book ID
- 111551562
- Publisher
- Springer
- Year
- 2003
- Tongue
- English
- Weight
- 271 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0021-891X
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